 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| DC - 8 GHz Terminated SPDT Switch Technical Data HMMC-2007 Features * Outputs Terminated in 50 When Off * Frequency Range: DC-8 GHz * Insertion Loss: 1.2 dB @ 8 GHz * Isolation: >70 dB @ 45 MHz >35 dB @ 8 GHz * Return Loss: 25 dB (Both Input and Selected Output) 18 dB Unselected Output * Switching Speed: <20 s (10%-90% RF) * P-1dB: 27 dBm * Harmonics (DC Coupled): <-80 dBc @ 10 dBm Description The HMMC-2007 is a GaAs monolithic microwave integrated circuit (MMIC) designed for low insertion loss and high isolation from DC to 8 GHz. It is intended for use as a general-purpose, single-pole, double-throw (SPDT), absorptive switch. Two series and two shunt MESFETs per throw provide 1.4 dB maximum insertion loss and 38 dB typical isolation at 6 GHz. HMMC-2007 chips use through-substrate vias to provide ground connections to the chip backside and minimize the number of wire bonds required. 5965-5451E Chip Size: Chip Size Tolerance: Chip Thickness: Pad Dimensions: 660 x 960 m (25.9 x 37.8 mils) 10 m ( 0.4 mils) 127 15 m (5.0 0.6 mils) 120 x 120 m (4.7 x 4.7 mils) Absolute Maximum Ratings[1] Symbol Vsel Pin Top TSTG Tmax Punsel Parameters/Conditions Select Voltages 1 and 2 RF Input Power Operating Temperature Storage Temperature Maximum Assembly Temp. Power into Unselected Output Units V dBm C C C dBm -55 -65 Min. -10.5 Max. +10.5 27 +125 +165 +200 27 Note: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. TA = 25C except for Top, TSTG, and Tmax. 7-26 DC Specifications/Physical Properties, TA = 25C Symbol I SEL -10 V I SEL +10 V Vp BVgss Parameters and Test Conditions Leakage Current @ -10 V Leakage Current @ +10 V Pinch-Off Voltage (VSEL2 = Vp, VRFout2 = +2 V, IRFout2 = 4 mA, VSEL1 = -10 V, VRFout1 = open circuit, VRFin = GND Breakdown Voltage (Test FET w/VD = VS = GND, IG = -50 A) Units A A V -6.75 Min. Typ. Max. 200 20 -3.00 V -13.0 RF Specifications, TA = 25C, ZO = 50 , Vsel-high = +10 V, Vsel-low = -10 V Symbol BW IL ISO RL in RL out-ON RL out-OFF P1 dB ts Parameters and Test Conditions Guaranteed Operating Bandwidth Insertion Loss, RFin to Selected RFout, f = 6 GHz, OFF throw Isolation, RFin to Unselected RFout, f = 6 GHz, OFF throw Input Return Loss @ 6 GHz Output Return Loss, ON throw @ 6 GHz Output Return Loss, OFF throw @ 6 GHz Input Power where IL increases by 1 dB Switching Speed, 10% - 90% RF Envelope fin = 2 GHz fin = 2 GHz Units GHz dB dB dB dB dB dBm s Min. DC 1.1 38 25 25 18 27 20 Typ. Max. 8.0 1.4 7-27 Applications The HMMC-2007 can be used in instrumentation, communications, radar, ECM, EW, and many other systems requiring SPDT switching. It can be used for pulse modulation, port isolation, transfer switching, high-speed switching, replacement of mechanical switches, and so on. Assembly Techniques Die attach should be done with conductive epoxy. Gold thermosonic bonding is recommended for all bonds. The top and bottom metallization is gold. For more detailed information see HP application note #999 "GaAs MMIC Assembly and Handling Guidelines." GaAs MMICs are ESD sensitive. Proper precautions should be used when handling these devices. S-Parameters[1], TA = 25C, ZO = 50 , Vsel high = 0 V, Vsel low = -10 V Freq. GHz dB 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 -26.41 -27.53 -30.69 -32.37 -31.79 -30.60 -28.53 -27.14 -26.46 -27.03 -28.64 -29.55 -26.88 -23.24 -21.53 -21.21 -20.92 -19.88 -18.65 -17.04 S11 Mag. 0.048 0.042 0.029 0.024 0.026 0.030 0.037 0.044 0.048 0.045 0.037 0.033 0.045 0.069 0.084 0.087 0.090 0.101 0.117 0.141 S21 (Insertion Loss) S31 (Isolation) S22 (ON Throw) S33 (OFF Throw) Ang. -57.11 -113.83 -176.73 115.57 61.35 4.27 -58.32 -124.01 172.69 107.19 32.44 -59.18 -156.32 130.95 70.91 15.06 -41.26 -104.30 -175.05 116.96 dB -1.08 -1.13 -1.18 -1.21 -1.25 -1.30 -1.33 -1.34 -1.37 -1.40 -1.42 -1.45 -1.51 -1.56 -1.52 -1.62 -1.64 -1.66 -1.84 -1.90 Mag. Ang. 0.88 0.88 0.87 0.87 0.87 0.86 0.86 0.86 0.85 0.85 0.85 0.85 0.84 0.84 0.84 0.83 0.83 0.83 0.81 0.80 -49.06 -93.69 -138.08 177.39 133.00 88.53 44.08 -0.53 -45.16 -89.79 -134.56 -179.46 135.54 90.76 46.04 0.47 -44.44 -90.23 -135.81 179.24 dB -67.74 -60.55 -56.17 -53.18 -50.38 -47.63 -45.67 -44.12 -42.68 -41.45 -40.28 -39.16 -38.12 -37.13 -36.36 -35.64 -34.83 -34.13 -33.62 -34.14 dB -28.40 -24.74 -31.91 -31.31 -28.90 -32.95 -29.26 -30.61 -32.21 -36.49 -34.51 -32.44 -27.18 -23.83 -21.48 -21.73 -22.22 -20.42 -18.17 -16.31 Mag. Ang. 0.03 0.05 0.02 0.02 0.03 0.02 0.03 0.02 0.02 0.01 0.01 0.02 0.04 0.06 0.08 0.08 0.07 0.09 0.12 0.15 -47.94 -117.54 168.76 119.22 68.41 -11.68 -44.21 -113.40 165.53 141.98 4.26 -100.27 176.54 122.00 51.31 -15.06 -81.88 -145.01 145.14 85.15 dB -32.26 -30.79 -30.35 -26.21 -26.38 -25.66 -22.99 -22.41 -21.68 -19.88 -19.89 -19.03 -18.28 -18.67 -18.61 -17.65 -16.95 -16.07 -14.94 -14.31 Mag. 0.024 0.029 0.030 0.049 0.048 0.052 0.071 0.076 0.082 0.101 0.101 0.112 0.122 0.117 0.117 0.131 0.142 0.157 0.179 0.193 Ang. 47.18 -38.11 -64.68 -134.70 151.66 103.24 38.61 -21.25 -75.25 -133.81 167.02 115.49 56.80 -2.63 -60.32 -124.25 172.46 115.03 59.82 3.39 Note: 1. Three-port-wafer-probed data: Port 1 = RF Input, Port 2 = Selected RF Output (i.e., ON throw), and Port 3 = Unselected RF Output (i.e., OFF throw). 7-28 RF COMMON RF2 RF1 SEL2 SEL1 Figure 1. HMMC-2007 Schematic. Recommended Operating Conditions, TA = 25C Select Line SEL1 +10V -10 V SEL2 -10 V +10V RF Path RF IN to RF OUT2 Isolated Low Loss RF IN to RF OUT1 Low Loss Isolated 7-29 HMMC-2007 Typical Performance 0 S21-ON, S31-ON ISOLATION (dB) 0 INPUT RETURN LOSS (dB) 0 INSERTION LOSS (dB) -1.0 -20 S21-OFF, S31-OFF -40 -10 -2.0 -20 S11 -3.0 -60 -30 -4.0 -80 -40 -5.0 0 5 FREQUENCY (GHz) 10 -100 0 5 FREQUENCY (GHz) 10 -50 0 5 FREQUENCY (GHz) 10 Figure 2. Insertion Loss[1] vs. Frequency. Figure 3. Input-to-Output Isolation[1] vs. Frequency. Figure 4. Input Return Loss[1] vs. Frequency. 0 OUTPUT RETURN LOSS (dB) GAIN COMPRESSION (dB) 0 -10 S33 -1 1 GHz -20 -2 10 MHz -3 -30 S22 -40 -4 -50 0 5 FREQUENCY (GHz) 10 -5 10 15 20 25 30 POWER INPUT (dBm) Figure 5. Output Return Loss[1] vs. Frequency. Figure 6. Gain Compression vs. Power Input. Note: 1. Data taken with the device mounted in modular breadboard package. 7-30 97 480 863 960 660 563 97 97 0 0 97 863 Figure 6. HMMC-2007 Bonding Pad Locations. (Dimensions in micrometers) Note: All compression data measured in an individual device mounted in an HP83040 Series Modular Microcircuit Package @ Tcase = 25C. This data sheet contains a variety of typical and guaranteed performance data. The information supplied should not be interpreted as a complete list of circuit specifications. In this data sheet the term typical refers to the 50th percentile performance. For additional information contact your local HP sales representative. 7-31 |
Price & Availability of HMMC-2007
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |